Organic Substrate Packaging Material Market Industry Analysis, Challenges, Drivers, Trends and Forecast to 2020-2025

Organic substrate packaging materials are the base materials that are utilized on the foundation layer of printed circuit boards (PCBs) to provide high reliability and enhanced electrical performance. Small outline (SO) packages, grid array (GA) packages, flat no-leads packages, quad flat package (QFP), dual in-line package (GIP), etc., are some of the common variants of organic substrate packaging materials. They are widely adopted across diverse industries, such as consumer electronics, automotive, manufacturing, healthcare, etc.


Organic Substrate Packaging Material Market Industry


Market Trends

The rising demand for semiconductor packaging due to the increasing adoption of portable electronic devices is primarily driving the market for organic substrate packaging materials. Furthermore, the growing popularity of miniaturized electronic devices across the healthcare, aviation, and military and defense sectors is also catalyzing the market growth. Moreover, the emergence of autonomous vehicles has augmented the use of organic substrate packaging materials in millimeter-wave automotive radar systems to detect obstacles. Additionally, the introduction of high-density, ultra-thin organic substrates with higher performance rate will continue to the drive the market for organic substrate packaging materials in the coming years.


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Organic Substrate Packaging Material Market 2020-2025 Analysis and Segmentation:


Some of these key players include:

Amkor Technology Inc.

ASE Kaohsiung (Advanced Semiconductor Engineering Inc.)

Compass Technology Co. Ltd.

Hitachi Chemical Company Ltd. (Hitachi and Showa Denko)

Kyocera Corporation

Mitsubishi Corporation

NGK Spark Plug Co. Ltd.

Shinko Electric Industries Co. Ltd. (Fujitsu)

STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.)

WUS Printed Circuit Co. Ltd.


Breakup by Technology:

Small Outline (SO) Packages

Grid Array (GA) Packages

Flat no-leads Packages

Quad Flat Package (QFP)

Dual in-line Package (GIP)

Others


Breakup by Application:

Consumer Electronics

Automotive

Manufacturing

Healthcare

Others


Explore full report with table of contents:https://www.imarcgroup.com/organic-substrate-packaging-material-market


Breakup by Region:

North America

Asia Pacific

Europe

Latin America

Middle East and Africa


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