Ball Grid Array (BGA) Packaging Market By Deployment, Capability, Equipment and End User Analysis by 2027

Ball Grid Array (BGA) Packaging Market


Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line or flat package. The entire bottom surface of the device can be used and traces connecting the package leads to wires connecting the die to the package, which are shorter hence provide better performance at high speed.


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Here we have listed the top companies in the world

1. Amkor Technology

2. TriQuint Semiconductor Inc.

3. Jiangsu Changjiang Electronics Technology

4. Corintech Ltd.

5. STATS ChipPAC

6. ASE Technology Holding

7. Integrated Circuit Engineering Corp.

8. Cypress Semiconductor Corp.

9. Infineon Technologies AG

10. NXP Semiconductors NV.


Ball Grid Array (BGA) Packaging Market


Rise in demand for high-performance denser type compact packaging in increasing number of diverse semiconductor and electronic devices such as smartphones, smartwatches, and TVs is the primary factor that propels the ball grid array (BGA) packaging market growth. However, non-compliant connectivity and difficulty of inspection, owing to critical and complex design of ball grid array (BGA) packaging tends to restrain the ball grid array (BGA) packaging market growth.

Ball Grid Array (BGA) Packaging Market


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Ball Grid Array (BGA) Packaging Market

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