The hybrid memory cube and high bandwidth memory market value is USD 1.23 billion and is estimated to grow the highest CAGR of 31.70% during the forecast period 2020-2026.
The hybrid memory cube and high bandwidth memory, both are high-performance RAM interfaces that are designed using AMD & Hynix and Silicon-Vias. These two RAM interfaces are worked for stacked DRAM memory for their superior features like high bandwidth, small form factor, and low cost. Since this combination allows for simultaneous access to several memory blocks, both are set to revolutionize memory access speed and overall performance. High bandwidth memory is used in combination with network devices and high-performance graphic processing units.
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